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EMMC BGA153 256GB

EMMC BGA153 256GB

Standard: eMMC 5.1
Interface: HS400
Capacity: 256 GB
Package:153 BGA
I/O Voltage:1.8 V/3.1 V
Operating Temperature: 0°C to+70°C
Package Size: 11.5x13x0.8 mm

Product Introduction
 

Product Description

 

  The eMMC BGA153 256GB is a high-capacity embedded eMMC storage solution designed for smart devices, consumer electronics, and IoT applications requiring reliable performance, efficient power consumption, and compact system integration.

  Integrating advanced 3D NAND Flash memory with a high-performance eMMC 5.1 controller, the eMMC BGA153 256GB combines storage media and flash management functions into a single compact BGA153 package, simplifying hardware design and reducing system complexity.

  Compliant with the JEDEC eMMC 5.1 standard, this 256GB eMMC Flash Memory supports high-speed interface modes including HS400, HS200, DDR52, and SDR52, enabling fast system boot-up, smooth application loading, and efficient multimedia processing.

  With optimized firmware algorithms and intelligent NAND management technologies, the eMMC BGA153 256GB delivers stable storage performance, enhanced flash endurance, and consistent operation for next-generation consumer electronic devices.

 

 

key features

eMMC 5.1 Interface

Compliant with the JEDEC eMMC 5.1 standard and backward compatible with earlier versions.

High-Speed Performance

Supports HS400, HS200, DDR52, and SDR52 with transfer speeds up to 400MB/s.

High-Capacity Embedded Storage

The eMMC BGA153 256GB provides high-density embedded storage capacity for modern smart devices.

 

Standard BGA153 Package

Adopts the industry-standard BGA153 package, enabling easy integration into compact embedded system designs.

Low Power Consumption

Operates with 3.3V VCC and 1.8V/3.3V VCCQ, helping reduce overall system power consumption.

Intelligent Data Management

Built-in features including ECC, Wear Leveling, Bad Block Management, TRIM, and Secure Erase help ensure data integrity and improve flash endurance.

Product Specification

 

Capacity

Continuous write (MB/s)

Continuous read (MB/s)

Random write (IOPS)

Random read (IOPS)

8GB

Up to 120

Up to 220

Up to 2800

Up to 3100

16GB

Up to 120

Up to 240

Up to 2800

Up to 3200

32GB

Up to 120

Up to 260

Up to 3000

Up to 3300

64GB

Up to 200

Up to 260

Up to 3000

Up to 3600

128GB

Up to 200

Up to 260

Up to 3100

Up to 3700

256GB

Up to 210

Up to 260

Up to 3200

Up to 3800

 

 

Supported Functions

 

- HS400,HS200,DDR52,SDR52

-High Priority Interrupt (HPI)

-Back-end operation, BKOPS control

-Packed CMD, command queue

- Cache,Cache Flushing Report,Cache Barrier(Optional)

-Partition, partition type, RPMB, RPMB bandwidth optimization

- Discard,Trim,Erase,Sanitize

-Write protection, secure write protection (optional)

-Lock/unlock

-Power off power notification (PON), Sleep/Awake

-Enhance reliability write operations

- Boot feature,Boot partition

-Hardware/software reset

-Configurable drive capability

 

Compatible Platforms

 

AP vendor

AP model P/N

RockChip

RK3126

RK3228, RK3228H, RK3229, RK328X

RK3308, RK3318, RK3328, RK3326, RK3368, RK3368H, RK3399

RK3566, RK3568, RK3588,RK3506

RK1808

RKPX30

RV1126, RV1109, RV1108, V1107

MTK

MT8163, MT8167, MT8168, MT8173

MT8735, MT8735B, MT8735M, MT8765, MT8766, MT8783, MT8788

MT8937

MT6580

MT6735, MT6737, MT6739, MT6753, MT6761, MT6763

Amlogic

S805

S905X, S905X2, S905X3, S905W

Allwinner

A20, A33, H6,T3,T536

Intel

Cherry Trail

Apollo Lake

Celeron N4000

Spreadtrum

SC7731E, SC9832, SC9863

Qualcomm

S801

Others

Actions, VIA, InfoTMIC, Realtek, Nvidia, Hisilicon, Msta

 

 

Product application

 

Consumer eMMC Factory

Why Choose YOTTAWIN

 

  With over 20 years of expertise in embedded storage technology, YOTTAWIN provides reliable eMMC storage solutions for consumer electronics, smart devices, IoT products, and embedded applications. Leveraging our independently developed controller technology, advanced Flash Translation Layer (FTL) algorithms, and high-quality 3D NAND Flash, our eMMC products deliver stable performance, optimized endurance, excellent compatibility, and long-term supply reliability.

  Combining strong storage engineering capabilities with firmware optimization expertise, rigorous quality management, and flexible customization support, YOTTAWIN is committed to delivering high-performance and reliable embedded storage solutions that meet diverse application requirements. From product development support to lifecycle management, we help customers achieve stable storage performance and scalable solutions for next-generation smart devices and embedded systems.

 

Flexible MOQ

 
 

High Reliability

 
 

Self-Developed Controller

 
 

Strong Compatibility

 

Quality & Reliability

 

  Our eMMC products undergo comprehensive validation and reliability testing to ensure stable performance in demanding embedded applications.

Reliability Testing

High & Low Temperature Test

Read/Write Endurance Test

Power Cycle Test

Data Retention Test

Vibration Test

Mechanical Shock Test

Thermal Cycling Test

Compatibility Verification

Burn-in Test

Power Failure Protection Verification

Quality Certifications

RoHS

RoHS

ISO

ISO

FC

FC

CE

CE

Ordering & Logistics

 

  YOTTAWIN offers reliable ordering and logistics services for eMMC BGA153 256 GB, including secure ESD packaging, flexible MOQ, fast sample delivery, OEM/ODM support, and worldwide shipping. With stable supply and efficient global logistics, we help customers shorten development cycles and support high-volume production.

 

product-1600-901

 

 

Product Models

 

Part Number

Density

Package size

Package Type

DYE008GFTC-EX

8GB

11.50×13.00×1.00(mm)

PBGA-153-Ball

DYE016GFTC-EX

16GB

11.50×13.00×1.00(mm)

PBGA-153-Ball

DYE032GFTC-EX

32GB

11.50×13.00×1.00(mm)

PBGA-153-Ball

DYE064GFTC-EX

64GB

11.50×13.00×1.00(mm)

PBGA-153-Ball

DYE128GFTC-EX

128GB

11.50×13.00×1.20(mm)

PBGA-153-Ball

DYE256GFTC-EX

256GB

11.50×13.00×1.20(mm)

PBGA-153-Ball

DYE008GOHC-EX

8GB

14.00×18.00×1.40(mm)

PBGA-100-Ball

DYE016GOHC-EX

16GB

14.00×18.00×1.40(mm)

PBGA-100-Ball

DYE032GOHC-EX

32GB

14.00×18.00×1.40(mm)

PBGA-100-Ball

DYE064GOHC-EX

64GB

14.00×18.00×1.40(mm)

PBGA-100-Ball

DYE128GOHC-EX

128GB

14.00×18.00×1.40(mm)

PBGA-100-Ball

DYE256GOHC-EX

256GB

14.00×18.00×1.40(mm)

PBGA-100-Ball

 

 

FAQ

Q: What is eMMC BGA153 256 GB?

A: The eMMC BGA153 256GB is a high-capacity embedded storage solution that integrates 3D NAND Flash memory and an eMMC controller into a compact BGA153 package. Designed for consumer electronics and embedded applications, it provides reliable storage performance, low power consumption, and simplified system integration.

Q: What is the difference between BGA153 and BGA100?

A: The main differences are package size, pin count, and application compatibility. eMMC BGA153 256GB provides more signal pins and is widely used in industrial automation, medical devices, communication equipment, and other embedded systems. BGA100 is more commonly used in compact consumer electronics with limited PCB space.

Q: What is the difference between Commercial eMMC and Industrial eMMC?

A: Industrial eMMC supports an operating temperature range of -40°C to +85°C, offering enhanced endurance, improved data integrity, and a longer product lifecycle. Commercial eMMC typically operates from 0°C to +70°C and is intended for standard consumer electronics.

Q: What is the MOQ?

A: The standard MOQ for eMMC BGA153 128GB is 100 pieces. For volume orders or OEM/ODM projects, please contact our sales team for customized pricing and delivery schedules.

Q: Are samples available?

A: Yes. We provide sample support for eMMC BGA153 256GB to help customers evaluate product performance and verify compatibility before mass production. Please contact our sales team for sample availability and delivery details.

Q: Which platforms are supported?

A: YOTTAWIN eMMC BGA153 256 GB is compatible with mainstream embedded platforms, including NXP i.MX, Rockchip, Allwinner, Amlogic, MediaTek, TI Sitara, and Renesas processors that support the eMMC 5.1 specification.

 

Contact Information

 

we are here for you

Have questions or need a quote? Contact our team-we're here to help.

email

sophia@yottac.cn

wenjing@yottac.cn

address
No.526 Xitai Road, Hi-tech Zone, Xi'an, Shaanxi Province, China
whatsApp/Wechat
+8613227880702 +8618091870795
phone

+8618091870795

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