Product Description
The eMMC BGA153 256GB is a high-capacity embedded eMMC storage solution designed for smart devices, consumer electronics, and IoT applications requiring reliable performance, efficient power consumption, and compact system integration.
Integrating advanced 3D NAND Flash memory with a high-performance eMMC 5.1 controller, the eMMC BGA153 256GB combines storage media and flash management functions into a single compact BGA153 package, simplifying hardware design and reducing system complexity.
Compliant with the JEDEC eMMC 5.1 standard, this 256GB eMMC Flash Memory supports high-speed interface modes including HS400, HS200, DDR52, and SDR52, enabling fast system boot-up, smooth application loading, and efficient multimedia processing.
With optimized firmware algorithms and intelligent NAND management technologies, the eMMC BGA153 256GB delivers stable storage performance, enhanced flash endurance, and consistent operation for next-generation consumer electronic devices.
key features
eMMC 5.1 Interface
Compliant with the JEDEC eMMC 5.1 standard and backward compatible with earlier versions.
High-Speed Performance
Supports HS400, HS200, DDR52, and SDR52 with transfer speeds up to 400MB/s.
High-Capacity Embedded Storage
The eMMC BGA153 256GB provides high-density embedded storage capacity for modern smart devices.
Standard BGA153 Package
Adopts the industry-standard BGA153 package, enabling easy integration into compact embedded system designs.
Low Power Consumption
Operates with 3.3V VCC and 1.8V/3.3V VCCQ, helping reduce overall system power consumption.
Intelligent Data Management
Built-in features including ECC, Wear Leveling, Bad Block Management, TRIM, and Secure Erase help ensure data integrity and improve flash endurance.
Product Specification
|
Capacity |
Continuous write (MB/s) |
Continuous read (MB/s) |
Random write (IOPS) |
Random read (IOPS) |
|
8GB |
Up to 120 |
Up to 220 |
Up to 2800 |
Up to 3100 |
|
16GB |
Up to 120 |
Up to 240 |
Up to 2800 |
Up to 3200 |
|
32GB |
Up to 120 |
Up to 260 |
Up to 3000 |
Up to 3300 |
|
64GB |
Up to 200 |
Up to 260 |
Up to 3000 |
Up to 3600 |
|
128GB |
Up to 200 |
Up to 260 |
Up to 3100 |
Up to 3700 |
|
256GB |
Up to 210 |
Up to 260 |
Up to 3200 |
Up to 3800 |
Supported Functions
- HS400,HS200,DDR52,SDR52
-High Priority Interrupt (HPI)
-Back-end operation, BKOPS control
-Packed CMD, command queue
- Cache,Cache Flushing Report,Cache Barrier(Optional)
-Partition, partition type, RPMB, RPMB bandwidth optimization
- Discard,Trim,Erase,Sanitize
-Write protection, secure write protection (optional)
-Lock/unlock
-Power off power notification (PON), Sleep/Awake
-Enhance reliability write operations
- Boot feature,Boot partition
-Hardware/software reset
-Configurable drive capability
Compatible Platforms
|
AP vendor |
AP model P/N |
|
RockChip |
RK3126 |
|
RK3228, RK3228H, RK3229, RK328X |
|
|
RK3308, RK3318, RK3328, RK3326, RK3368, RK3368H, RK3399 |
|
|
RK3566, RK3568, RK3588,RK3506 |
|
|
RK1808 |
|
|
RKPX30 |
|
|
RV1126, RV1109, RV1108, V1107 |
|
|
MTK |
MT8163, MT8167, MT8168, MT8173 |
|
MT8735, MT8735B, MT8735M, MT8765, MT8766, MT8783, MT8788 |
|
|
MT8937 |
|
|
MT6580 |
|
|
MT6735, MT6737, MT6739, MT6753, MT6761, MT6763 |
|
|
Amlogic |
S805 |
|
S905X, S905X2, S905X3, S905W |
|
|
Allwinner |
A20, A33, H6,T3,T536 |
|
Intel |
Cherry Trail |
|
Apollo Lake |
|
|
Celeron N4000 |
|
|
Spreadtrum |
SC7731E, SC9832, SC9863 |
|
Qualcomm |
S801 |
|
Others |
Actions, VIA, InfoTMIC, Realtek, Nvidia, Hisilicon, Msta |
Product application

Why Choose YOTTAWIN
With over 20 years of expertise in embedded storage technology, YOTTAWIN provides reliable eMMC storage solutions for consumer electronics, smart devices, IoT products, and embedded applications. Leveraging our independently developed controller technology, advanced Flash Translation Layer (FTL) algorithms, and high-quality 3D NAND Flash, our eMMC products deliver stable performance, optimized endurance, excellent compatibility, and long-term supply reliability.
Combining strong storage engineering capabilities with firmware optimization expertise, rigorous quality management, and flexible customization support, YOTTAWIN is committed to delivering high-performance and reliable embedded storage solutions that meet diverse application requirements. From product development support to lifecycle management, we help customers achieve stable storage performance and scalable solutions for next-generation smart devices and embedded systems.
Flexible MOQ
High Reliability
Self-Developed Controller
Strong Compatibility
Quality & Reliability
Our eMMC products undergo comprehensive validation and reliability testing to ensure stable performance in demanding embedded applications.
Reliability Testing
High & Low Temperature Test
Read/Write Endurance Test
Power Cycle Test
Data Retention Test
Vibration Test
Mechanical Shock Test
Thermal Cycling Test
Compatibility Verification
Burn-in Test
Power Failure Protection Verification
Quality Certifications

RoHS

ISO

FC

CE
Ordering & Logistics
YOTTAWIN offers reliable ordering and logistics services for eMMC BGA153 256 GB, including secure ESD packaging, flexible MOQ, fast sample delivery, OEM/ODM support, and worldwide shipping. With stable supply and efficient global logistics, we help customers shorten development cycles and support high-volume production.

Product Models
|
Part Number |
Density |
Package size |
Package Type |
|
DYE008GFTC-EX |
8GB |
11.50×13.00×1.00(mm) |
PBGA-153-Ball |
|
DYE016GFTC-EX |
16GB |
11.50×13.00×1.00(mm) |
PBGA-153-Ball |
|
DYE032GFTC-EX |
32GB |
11.50×13.00×1.00(mm) |
PBGA-153-Ball |
|
DYE064GFTC-EX |
64GB |
11.50×13.00×1.00(mm) |
PBGA-153-Ball |
|
DYE128GFTC-EX |
128GB |
11.50×13.00×1.20(mm) |
PBGA-153-Ball |
|
DYE256GFTC-EX |
256GB |
11.50×13.00×1.20(mm) |
PBGA-153-Ball |
|
DYE008GOHC-EX |
8GB |
14.00×18.00×1.40(mm) |
PBGA-100-Ball |
|
DYE016GOHC-EX |
16GB |
14.00×18.00×1.40(mm) |
PBGA-100-Ball |
|
DYE032GOHC-EX |
32GB |
14.00×18.00×1.40(mm) |
PBGA-100-Ball |
|
DYE064GOHC-EX |
64GB |
14.00×18.00×1.40(mm) |
PBGA-100-Ball |
|
DYE128GOHC-EX |
128GB |
14.00×18.00×1.40(mm) |
PBGA-100-Ball |
|
DYE256GOHC-EX |
256GB |
14.00×18.00×1.40(mm) |
PBGA-100-Ball |
FAQ
Q: What is eMMC BGA153 256 GB?
A: The eMMC BGA153 256GB is a high-capacity embedded storage solution that integrates 3D NAND Flash memory and an eMMC controller into a compact BGA153 package. Designed for consumer electronics and embedded applications, it provides reliable storage performance, low power consumption, and simplified system integration.
Q: What is the difference between BGA153 and BGA100?
A: The main differences are package size, pin count, and application compatibility. eMMC BGA153 256GB provides more signal pins and is widely used in industrial automation, medical devices, communication equipment, and other embedded systems. BGA100 is more commonly used in compact consumer electronics with limited PCB space.
Q: What is the difference between Commercial eMMC and Industrial eMMC?
A: Industrial eMMC supports an operating temperature range of -40°C to +85°C, offering enhanced endurance, improved data integrity, and a longer product lifecycle. Commercial eMMC typically operates from 0°C to +70°C and is intended for standard consumer electronics.
Q: What is the MOQ?
A: The standard MOQ for eMMC BGA153 128GB is 100 pieces. For volume orders or OEM/ODM projects, please contact our sales team for customized pricing and delivery schedules.
Q: Are samples available?
A: Yes. We provide sample support for eMMC BGA153 256GB to help customers evaluate product performance and verify compatibility before mass production. Please contact our sales team for sample availability and delivery details.
Q: Which platforms are supported?
A: YOTTAWIN eMMC BGA153 256 GB is compatible with mainstream embedded platforms, including NXP i.MX, Rockchip, Allwinner, Amlogic, MediaTek, TI Sitara, and Renesas processors that support the eMMC 5.1 specification.
Contact Information
we are here for you
Have questions or need a quote? Contact our team-we're here to help.
sophia@yottac.cn
wenjing@yottac.cn
+8618091870795
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